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BGA pad design

date：Nov 10,2018

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BGA pad design


1. Design the SMD pads on the outermost ball of the BGA. If you can, it would be better to design the outer two rows of tin balls in the four corners of the BGA as SMD pads. Only SMD pads will reduce the space for signal routing.


2. Other pads are designed as NSMD pads to give more signal space.

Other pads are designed as NSMD pads, giving more signal routing space.


FASTPCBA-B2

3. Basically, SMD pads will enhance the bonding force of the pads, which can solve the problem that the pads are pulled up, but the solder itself is not very good. Therefore, if the design of the above SMD pads still occurs between the BGA solder balls and the pads, then Shenzhen Honglijie will recommend changing the BGA outermost solder ball pads back to the NSMD pads, and The pad is padded with a via and electroplated. This is because the bonding force between NSMD's solder pad and FR4 is not good enough. Putting the via hole is like riving the soldering pad, which can enhance the bonding force with FR4, but the PCB will probably increase the cost by 10%.

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