Online pcb manufacturing component defect cause and solution

Defect description

1.Tomb

Analysis of the causes of defects

A. The hot wind is too strong, the components are impacted and raised, forming a monument

B. PCB immersion tin is too deep

Solutions

A. Reduce hot air knife wind

B. Reduce the depth of immersion tin

2. Component burns

Analysis of the causes of defects

A. The preheating temperature is too high, and the components are burnt by high temperature for a long time.

B. Immersiontin is too deep

C. The temperature of the tin pot is too high

Solution

A. Adjust the preheating temperature

B. Adjusting the depth of immersion tin

C. Adjust the temperature of the tin pot